?kemet electronics corporation, p.o. box 5928, greenville, s.c. 29606, (864) 963-6300 ceramic open mode capacitors applications: markets: ? input side filtering (power plane/bus) ? automotive ? high current applications (battery line) - all applications connected directly to the battery ? circuits that cannot be fused to open when - conversion to 42v power system ? power conversion - raw power input side filtering short circuits occur due to flex cracks m e t r i c eia si ze size code code l - length w - width b - bandwidth separation 2012 0805 2.00 (.079) .20 (.008) 1.25 (.049) .20 (.008) 0.50 (.02) .25 (.010) 0.75 (.030) 3216 1206 3.20 (.126) .20 (.008) 1.60 (.063) .20 (.008) 0.50 (.02) .25 (.010) n/a 3225 1210 3.20 (.126) .20 (.008) 2.50 (.098) .20 (.008) 0.50 (.02) .25 (.010) n/a note: for thickness dimensions, see table 2. c 1812 f 105 k 1 r a c style c - ceramic size code 0805, 1206, 1210, 1812 specification f - open-mode capacitance code, pf first two digits represent significant figures. third digit specifies number of zeros. 100 pf = 101. (use 9 for 1.0 through 9.9 pf) (use 8 for 0.1 through .99 pf) capacitance tolerance k = 10% m = 20% voltage 2 = 200v 5 = 50v 1 = 100v 3 = 25v 4 = 16v temperature characteristic designated by capacitance change over temperature range r C x7r (15%) (-55c +125c) end metallization c = standard failure rate level a = not applicable the open-mode dimension (om) exceeds the termination bandwidth dimensions: om >bw features outline drawing table 1 - dimensions - millimeters (inches) capacitor ordering information open-mode internal design kemets open mode ceramic surface mount capacitor is designed to significantly minimize the probability of a low ir or short circuit condition when forced to failure in a board flex situation. this reduces the poten- tial for causing catastrophic failures. this product is rohs compliant. metric size code eia size code l - length w - width b - bandwidth separation 2012 0805 2.0 (.079) .20 (.008) 1.25 (.049) 0.2 (.008) 0.50 (.02) .25 (.010) 0.75 (.030) 3216 1206 3.2 (.126) .20 (.008) 1.6 (.063) 0.2 (.008) 0.50 (.02) .25 (.010) n/a 3225 1210 3.2 (.126) .20 (.008) 2.5 (.098) 0.2 (.008) 0.50 (.02) .25 (.010) n/a 4532 1812 4.5 (.177) 0.3 (.012) 3.2 (.126) 0.3 (.012) 0.60 (.024) .35 (.014) n/a w l t b s tin plate nickel plate conductive metallization electrodes 79 ceramic surface mount
?kemet electronics corporation, p.o. box 5928, greenville, s.c. 29606, (864) 963-6300 ceramic open mode capacitors table 2 x7r dielectric capacitance range and thickness targets (mm) ceramic surface mount thickness and packaging information 16v 25v 50v 100v 200v 16v 25v 50v 100v 200v 16v 25v 50v 100v 200v 25v 50v 100v 200v 102 dd dd dd dd dd 122 dd dd dd dd dd 152 dd dd dd dd dd 182 dd dd dd dd dd 222 dd dd dd dd dd 272 dd dd dd dd dd 332 dd dd dd dd dd 392 dd dd dd dd dd 472 dd dd dd dd dd 562 dd dd dd dd dd 682 dd dd dd dd dd 822 dd dd dd dd dd 103 dd dd dd dd dd 123 dd dd dd dd dg 153 dd dd dd dd dg 183 dd dd dd dd ec 223 dd dd dd dg ec 273 dd dd dd dg ec 333 dd dd dd dg ec 393 dd dd dd dg ec 473 dd dd dd de ec ec ec ec eg gb 563 dd dd dd ec ec ec ec eg gb 683 dd dd dg dg ec ec ec ec eg fd gb 823 dd dd dg ec ec ec ec eg fd gb 104 dg dg dg ec ec ec ec eg fd fd fd fd fg gb gb gb gb 124 dg dg ec ec ec ec fd fd fd fd fg gb gb gb gb 154 dg dg ec ec ec eg fd fd fd fd fh gb gb gb gb 184 dg dg ec ec ec eg fd fd fd fd fh gb gb gb gb 224 dg dd dg ec ec ec ed fd fd fd fg fj gb gb gb gc 274 ec ec ec fd fd fd fg gb gb gb gf 334 eg eg fd fd fd fh gb gb gb gk 394 eg eg fd fd fg fh gb gb gb gl 474 de dg eg eg ec fd fd fg fj gb gb gc 564 eg fd fd fg fr gb gb gd 684 dg eg fd fg fh fr gd gd gf 824 eg fd fg fj gd gd gk 105 eg ec eh fd fh fj fq gn gn gm 125 fg 155 fh 185 fh 225 ec eh fj fm 475 eh fg fm 1812 0805 1206 cap code 1210 thickness code series dimension 7" reel qty. 13" reel qty. dd 0805 .90 .10 4000 10000 de 0805 1.00 .10 2500 10000 dg 0805 1.25 .15 2500 10000 ec 1206 .90 .10 4000 10000 eg 1206 1.60 .15 2000 8000 eh 1206 1.60 .20 2000 8000 fd 1210 .95 .10 4000 10000 fg 1210 1.25 .15 2500 10000 fh 1210 1.55 .15 2000 8000 fj 1210 1.85 .20 2000 8000 fm 1210 1.70 .20 2000 8000 fr 1210 2.25 .20 2000 8000 fq 1210 2.5 .20 1500 8000 gb 1812 1.0 .10 1000 4000 gc 1812 1.1 .10 1000 4000 gd 1812 1.25 .15 1000 4000 gf 1812 1.50 .15 1000 4000 gk 1812 1.60 .20 1000 4000 gl 1812 1.90 .20 1000 4000 gm 1812 2.00 .20 1000 4000 gn 1812 1.70 .20 1000 4000 80 16v 25v 50v 100v 200v 16v 25v 50v 100v 200v 16v 25v 50v 100v 200v 25v 50v 100v 200v 102 dd dd dd dd dd 122 dd dd dd dd dd 152 dd dd dd dd dd 182 dd dd dd dd dd 222 dd dd dd dd dd 272 dd dd dd dd dd 332 dd dd dd dd dd 392 dd dd dd dd dd 472 dd dd dd dd dd 562 dd dd dd dd dd 682 dd dd dd dd dd 822 dd dd dd dd dd 103 dd dd dd dd dd 123 dd dd dd dd dg 153 dd dd dd dd dg 183 dd dd dd dd ec 223 dd dd dd dg ec 273 dd dd dd dg ec 333 dd dd dd dg ec 393 dd dd dd dg ec 473 dd dd dd de ec ec ec ec eg gb 563 dd dd dd ec ec ec ec eg gb 683 dd dd dg dg ec ec ec ec eg fd gb 823 dd dd dg ec ec ec ec eg fd gb 104 dg dg dg ec ec ec ec eg fd fd fd fd fg gb gb gb gb 124 dg dg ec ec ec ec fd fd fd fd fg gb gb gb gb 154 dg dg ec ec ec eg fd fd fd fd fh gb gb gb gb 184 dg dg ec ec ec eg fd fd fd fd fh gb gb gb gb 224 dg dd dg ec ec ec ed fd fd fd fg fj gb gb gb gc 274 ec ec ec fd fd fd fg gb gb gb gf 334 eg eg eg eg fd fd fd fh gb gb gb gk 394 eg eg fd fd fg fh gb gb gb gl 474 de dg eg eg ec fd fd fg fj gb gb gc 564 eg fd fd fg fr gb gb gd 684 dg eg fd fg fh fr gd gd gf 824 eg fd fg fj gd gd gk 105 eg ec eh fd fh fj fq gn gn gm 125 fg 155 fh 185 fh 225 ec eh fj fm 475 eh fg fm 685 fq 1812 0805 1206 cap code 1210
?kemet electronics corporation, p.o. box 5928, greenville, s.c. 29606, (864) 963-6300 kemet offers multilayer ceramic chip capacitors packaged in 8mm and 12mm plastic tape on 7" and 13" reels in accordance with eia standard 481-1: taping of surface mount components for automatic handling. this packaging system is compatible with all tape fed automatic pick and place systems. see page 7 8 for details on reeling quantities for commercial chips and page 87 for mil-prf-55681 chips. ceramic chip capacitors packaging information tape & reel packaging 8mm .30 (.315 .012") or 12mm .30 (.472 .012") 178mm (7.00") or 330mm (13.00") anti-static reel embossed carrier* 0402 and 0603 case sizes available on punched paper only. embossment anti-static cover tape (.10mm (.004") max thickness) chip orientation in pocket (except 1825 commercial, and 1825 & 2225 military) * punched paper carrier used for 0402 and 0603 case size. g handling. this packaging system is compatible with all tape fed automatic pick and place systems. see page 81 for details on reeling quantities for commercial chips and page 90 for mil-prf-55681 chips. kemet ? x c g z y grid placement courtyard z 2.14 2.78 3.30 4.50 4.50 5.90 5.90 7.00 7.00 g 0.28 0.68 0.70 1.50 1.50 2.30 2.30 3.30 3.30 x 0.74 1.08 1.60 2.00 2.90 3.70 6.90 5.50 6.80 y(ref) 0.93 1.05 1.30 1.50 1.50 1.80 1.80 1.85 1.85 c(ref) 1.21 1.73 2.00 3.00 3.00 4.10 4.10 5.15 5.15 z 3.18 3.70 4.90 4.90 g 0.68 0.70 1.50 1.50 x 0.80 1.10 1.40 2.00 y(ref) 1.25 1.50 1.70 1.70 smin 1.93 2.20 3.20 3.20 wave solder reflow solder calculation formula z = lmin + 2jt + tt g = smax - 2jh -th x = wmin + 2js + ts tt, th, ts = combined tolerances 0402 0603 0805 1206 1210 1812 1825 2220 2225 dimension not recommended not recommended ! " # $ surface mount land dimensions - ceramic chip capacitors - mm 93 packaging
?kemet electronics corporation, p.o. box 5928, greenville, s.c. 29606, (864) 963-6300 performance notes 1. cover tape break force: 1.0 kg minimum. 2. cover tape peel strength: the total peel strength of the cover tape from the carrier tape shall be: tape width peel strength 8 mm 0.1 newton to 1.0 newton (10g to 100g) 12 mm 0.1 newton to 1.3 newton (10g to 130g) the direction of the pull shall be opposite the direction of the carrier tape travel. the pull angle of the carrier tape shall be 165 to 180 from the plane of the carrier tape. during peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 10 mm/minute. 3. reel sizes: molded tantalum capacitors are available on either 180 mm (7") reels (standard) or 330 mm (13") reels (with c-7280). note that 13 reels are preferred. 4. labeling: bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. refer to eia-556. embossed carrier tape configuration: figure 1 notes 1. b1 dimension is a reference dimension for tape feeder clearance only. 2. the embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. dimensions of embossment location and hole location shall be applied independent of each other. 3. tape with components shall pass around radius r without damage (see sketch a). the minimum trailer length (fig. 2) may require additional length to provide r min. for 12 mm embossed tape for reels with hub diameters approaching n min. (table 2) 4. the cavity defined by a 0 , b 0 , and k 0 shall be configured to surround the part with sufficient clearance such that the chip does not pro- trude beyond the sealing plane of the cover tape, the chip can be removed from the cavity in a vertical direction without mecha nical restriction, rotation of the chip is limited to 20 degrees maximum in all 3 planes, and lateral movement of the chip is restric ted to 0.5 mm maximum in the pocket (not applicable to vertical clearance.) table 1 embossed tape dimensions (metric will govern) constant dimensions millimeters (inches) tape size d 0 ep 0 p 2 t max t 1 max 8 mm 1.5 1.75 0.10 4.0 0.10 2.0 0.05 0.600 0.100 and +0.10 -0.0 12 mm (0.059 (0.069 0.004) (0.157 0.004) (0.079 0.002) (0.024) (0.004) +0.004, -0.0) variable dimensions millimeters (inches) tape size pitch b 1 max. d 1 min. f p 1 r min. t 2 max w a 0 b 0 k 0 note 1 note 2 note 3 note 4 8 mm single 4.4 1.0 3.5 0.05 4.0 0.10 25.0 2.5 8.0 0.30 (4 mm) (0.173) (0.039) (0.138 0.002) (0.157 0.004) (0.984) (0.098) (.315 0.012) 12 mm double 8.2 1.5 5.5 0.05 8.0 0.10 30.0 4.6 12.0 0.30 (8 mm) (0.323) (0.059) (0.217 0.002) (0.315 0.004) (1.181) (0.181) (0.472 0.012) tantalum, ceramic and aluminum chip capacitors packaging information 94
?kemet electronics corporation, p.o. box 5928, greenville, s.c. 29606, (864) 963-6300 embossed carrier tape configuration (cont.) sketch d: tape camber (top view) allowable camber to be 1 mm/250 mm. 250mm (9.843) 1mm (0.039) max. 1mm (0.039) max. table 2 C reel dimensions (metric will govern) figure 3: reel dimensions (metric dimensions will govern) tape size a max b* min c d* min n min w 1 w 2 max w 3 8 mm 330.0 1.5 13.0 0.20 20.2 50.0 8.4 14.4 7.9 min (12.992) (0.059) (0.512 0.008) (0.795) (1.969) +1.5, -0.0 (0.567) (0.311) see (0.331 10.9 max note 3 +0.059, -0.0) (0.429) 12 mm 330.0 1.5 13.0 0.20 20.2 table 1 12.4 18.4 11.9 min (12.992) (0.059) (0.512 0.008) (0.795) +2.0, -0.0 (0.724) (0.469) (0.488 15.4 max +0.078, -0.0) (0.606) tantalum, ceramic and aluminum chip capacitors packaging information figure 2: tape leader & trailer dimensions (metric dimensions will govern) 400mm (15.75) min. 20 95 packaging
?kemet electronics corporation, p.o. box 5928, greenville, s.c. 29606, (864) 963-6300 20 20 maximum component rotation. typical component center line punched carrier (paper tape) configuration (ceramic chips only): table 1: 8 & 12mm punched tape ( metric dimensions will govern) variable dimensions - millimeters (inches) note: 1. a 0 , b 0 and t determined by the maximum dimensions to the ends of the terminals extending from the body and/or the body dimensions of the component. the clearance between the ends of the terminals or body of the component to the sides and depth of the cavity (a 0 , b 0 and t) must be within 0.05mm (.002) minimum and 0.50mm (.020) maximum. the clearance allowed must also prevent rotation of the component within the cavity of not more than 20 degrees (see sketches a and b). 2. tape with components shall pass around radius "r" without damage. 3. kemet nominal thicknesses are: 0402 = 0.6mm and all others 0.95mm minimum. 8mm and 12mm 1.5 +0.10, -0.0 (.059 +0.004, -0.0) 1.75 0.10 (.069 0.004) 4.0 0.10 (.157 0.004) 2.0 0.05 (.079 0.002) 0.10 (.004) max. 0.75 (.030) min. 0.75 (.030) min. 25 (.984) see note 2 table 1 tape size d 0 p 0 e p 2 t 1 g 1 g 2 r min. 8mm 1/2 pitch 2.0 0.10 (.079 .004) see require- ments section 3.3 (d) 3.5 0.05 (.138 .002) 8.0 0.3 (.315 0.012) see note 1 table 1 1.1mm (.043) max. for paper base tape and 1.6mm (.063) max. for non- paper base compositions. see note 3. tape size p 1 w f a 0 b 0 t 8mm 4.0 0.10 (0.157 .004) 12mm 4.0 0.10 (0.157 .004) 12mm double pitch 8.0 0.10 (0.315 .004) 12.0 0.3 (.472 .012) 5.5 0.05 (.217 .002) table 1: 8 & 12mm punched tape ( metric dimensions will govern) constant dimensions - millimeters (inches) sketch b: max. component rotation - front cross sectional view sketch c: component rotation - top view a 0 b 0 p 1 p 0 p 2 d 0 f e w center lines of cavity 10 pitches cumulative tolerance on tape 0.2 ( 0.008) to p tape cover t user direction of feed t 1 max. cavity size see note 1 table 1 bottom tape cover g 2 r (min.) sketch a: bending radius see note 2 table 1 ceramic chip capacitors packaging information 96
?kemet electronics corporation, p.o. box 5928, greenville, s.c. 29606, (864) 963-6300 ceramic chip capacitors packaging information capacitor marking table (marking optional - not available for 0402 size or y5v dielectric) a b c d e f g h j k l m n p q r s t u v w x y z a b d e f m n t y 0.10 0.11 0.12 0.13 0.15 0.16 0.18 0.20 0.22 0.24 0.27 0.30 0.33 0.36 0.39 0.43 0.47 0.51 0.56 0.62 0.68 0.75 0.82 0.91 0.25 0.35 0.40 0.45 0.50 0.60 0.70 0.80 0.90 1.0 1.1 1.2 1.3 1.5 1.6 1.8 2.0 2.2 2.4 2.7 3.0 3.3 3.6 3.9 4.3 4.7 5.1 5.6 6.2 6.8 7.5 8.2 9.1 2.5 3.5 4.0 4.5 5.0 6.0 7.0 8.0 9.0 10 11 12 13 15 16 18 20 22 24 27 30 33 36 39 43 47 51 56 62 68 75 82 91 25 35 40 45 50 60 70 80 90 100 110 120 130 150 160 180 200 220 240 270 300 330 360 390 430 470 510 560 620 680 750 820 910 250 350 400 450 500 600 700 800 900 1000 1100 1200 1300 1500 1600 1800 2000 2200 2400 2700 3000 3300 3600 3900 4300 4700 5100 5600 6200 6800 7500 8200 9100 2500 3500 4000 4500 5000 6000 7000 8000 9000 10,000 11,000 12,000 13,000 15,000 16,000 18,000 20,000 22,000 24,000 27,000 30,000 33,000 36,000 39,000 43,000 47,000 51,000 56,000 62,000 68,000 75,000 82,000 91,000 25,000 35,000 40,000 45,000 50,000 60,000 70,000 80,000 90,000 100,000 110,000 120,000 130,000 150,000 160,000 180,000 200,000 220,000 240,000 270,000 300,000 330,000 360,000 390,000 430,000 470,000 510,000 560,000 620,000 680,000 750,000 820,000 910,000 250,000 350,000 400,000 450,000 500,000 600,000 700,000 800,000 900,000 alpha character numeral 9 01 2 3 4 5 capacitance (pf) for various numeral identifiers 1,000,000 1,100,000 1,200,000 1,300,000 1,500,000 1,600,000 1,800,000 2,000,000 2,200,000 2,400,000 2,700,000 3,000,000 3,300,000 3,600,000 3,900,000 4,300,000 4,700,000 5,100,000 5,600,000 6,200,000 6,800,000 7,500,000 8,200,000 9,100,000 2,500,000 3,500,000 4,000,000 4,500,000 5,000,000 6,000,000 7,000,000 8,000,000 9,000,000 7 10,000,000 11,000,000 12,000,000 13,000,000 15,000,000 16,000,000 18,000,000 20,000,000 22,000,000 24,000,000 27,000,000 30,000,000 33,000,000 36,000,000 39,000,000 43,000,000 47,000,000 51,000,000 56,000,000 62,000,000 68,000,000 75,000,000 82,000,000 91,000,000 25,000,000 35,000,000 40,000,000 45,000,000 50,000,000 60,000,000 70,000,000 80,000,000 90,000,000 6 laser marking is available as an extra-cost option for most kemet ceramic chips. such marking is two sided, and includes a k to identify kemet, followed by two characters (per eia-198 - see table below) to identify the capacitance value. note that marking is not available for size 0402 nor for any y5v chip. in addition, the 0603 marking option is limited to the k only. example shown is 1,000 pf capacitor. ka3 table 2 C capacitance values available in bulk cassette packaging 0402 0603 0805 all all c0g x7r y5v all all 109 109 109 221 221 221 221 221 104 104 all all 181 331 102 392 103 273 104 104 224 224 case size dielectric voltage min. cap value max. cap value all all 200 100 50 200 100 50 25 16 25 16 terminations: kemet nickel barrier layer with a tin overplate. 0.3 0.7 0.75 eia size code length l width w thickness t bandwidth b minimum separation s metric size code number of pcs/cassette 50,000 15,000 10,000 0402 0603 0805 1.0 0.05 1.6 0.07 2.0 0.10 0.5 0.05 0.8 0.07 1.25 0.10 0.5 .05 0.8 .07 0.6 .10 0.2 to 0.4 0.2 to 0.5 0.5 to 0.75 1005 1608 2012 table 1 C capacitor dimensions for bulk cassette packaging C millimeters unit: mm * reference 110 0.7 31.5 0 0.2 36 0 0.2 19.0* 5.0* 10* 53.3* 6.8 0.1 8.8 0.1 12.0 0.1 3.0 0 0.2 2.0 0.1 0 1.5 0 0.1 bulk cassette packaging (ceramic chips only) (meets dimensional requirements iec-286-6 and eiaj 7201) 97 packaging
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